Danaos Highlights Baya Systems' Chiplet Innovation Ahead of 2025 Design Automation Conference
- Baya Systems will showcase chiplet innovations at the 2025 DAC, emphasizing their importance in AI and computing.
- CEO Dr. Sailesh Kumar will discuss chiplet architectures addressing efficiency and data movement challenges at the conference.
- Baya's participation highlights its leadership in semiconductor innovation and commitment to collaborative chiplet technology development.
Baya Systems Champions Chiplet Innovation Ahead of 2025 DAC
Baya Systems, a frontrunner in high-performance semiconductor technologies, is set to showcase its innovative capabilities at the upcoming 2025 Design Automation Conference (DAC) in San Francisco. The event, taking place from June 24, 2025, at the Moscone Center, will see Baya featured prominently in the EE Times Chiplet Pavilion. This participation underscores the company’s role in the evolution of the chiplet economy, which is increasingly vital in meeting the demands of artificial intelligence (AI) and modern computing. Baya's executives are poised to engage industry peers on the pivotal advancements in modular architectures necessary for the future.
The conference includes two key sessions that delve into the intricacies of chiplet adoption. Baya’s Chief Commercial Officer, Nandan Nayampally, will lead the session titled "Developing the Chiplet Economy," focusing on the commercial and technical challenges surrounding chiplet technology. Nayampally will address crucial issues such as interface standards and integration complexities, emphasizing the need for collaboration among foundries and tool vendors to foster a thriving chiplet ecosystem. This dialogue is essential for stakeholders looking to navigate the complexities involved in adopting chiplet solutions, which promise to revolutionize semiconductor design.
In the second session, CEO Dr. Sailesh Kumar will present "Unleashing Scale Through Chiplets – From Concept to Deployment." Dr. Kumar will highlight the growing demand for efficient computing and data movement driven by AI, illustrating how chiplet architectures can address these needs. He will provide real-world examples of Baya’s chiplet-ready intellectual property (IP) in action, showcasing how these solutions can effectively tackle challenges related to power consumption, cost, and development time. Attendees at booth 2430 will have the opportunity to explore Baya's suite of chiplet-ready design capabilities and fabric solutions, confirming the company’s commitment to technological advancement in a rapidly evolving industry.
Baya Systems' active participation in the DAC reflects its strategic focus on chiplet technology, positioning the company at the forefront of semiconductor innovation. As the industry shifts towards modular architectures, Baya aims to lead the conversation, demonstrating how its solutions can facilitate scalable and efficient designs that meet the growing demands of AI and other high-performance applications. This initiative not only highlights Baya’s technical prowess but also reinforces the importance of collaborative efforts in overcoming the challenges inherent in the semiconductor landscape.
As Baya prepares for the DAC, the company is set to reinforce its reputation as a key player in the semiconductor industry, providing insights and solutions that align with the future of technology. This engagement signifies a broader trend in the industry towards embracing chiplet architectures, promising a new era of flexibility and efficiency in semiconductor design.
