Group 1 Automotive: Breakthrough Semiconductor Technology Enhances Automotive Applications and Performance
- Group 1 Automotive benefits from SK keyfoundry's Direct RDL technology, improving automotive electronics performance and reliability.
- The Direct RDL technology meets Auto Grade 1 standards, ensuring durability in extreme automotive conditions.
- SK keyfoundry's advancements support Group 1 Automotive's shift towards high-performance electronic components and efficient manufacturing solutions.
Innovative Semiconductor Technology Boosts Automotive Applications
In a recent collaboration between SK keyfoundry and LB Semicon, a significant breakthrough in semiconductor packaging technology emerges, targeting the automotive industry. The development of Direct RDL (Redistribution Layer) technology enhances electrical connectivity through advanced metal wiring and insulating layers on semiconductor chips. This innovation is particularly relevant for automotive applications, as it supports power semiconductors capable of handling high current capacities. Achieving a metal wiring thickness of up to 15 μm and covering 70% of chip area, Direct RDL is set to enhance the performance and reliability of automotive electronics.
The Direct RDL technology meets the stringent Auto Grade 1 classification under the AEC-Q100 international automotive semiconductor quality standard. This classification ensures that the technology can endure extreme temperatures ranging from –40℃ to +125℃, making it highly suitable for the demanding conditions faced in automotive environments. By providing a Design Guide and Process Development Kit, SK keyfoundry aims to assist manufacturers in creating smaller chip sizes and reducing power consumption while offering cost-effective packaging solutions. This advancement is particularly timely as the automotive sector increasingly leans towards high-performance electronic components.
The collaboration between SK keyfoundry and LB Semicon not only shortens development timelines but also enhances production efficiency. Integrating LB Semicon's back-end processing expertise with SK keyfoundry's foundry capabilities positions both companies as frontrunners in the next-generation semiconductor packaging market. LB Semicon's CEO, Namseog Kim, emphasizes that this joint effort represents a pivotal milestone in bolstering their technological competitiveness. As the automotive industry demands higher reliability and innovative solutions, the advancements in semiconductor technology by these two companies could redefine standards and capabilities within the sector.
In related news, Amsted Automotive's Burgess-Norton division has been recognized for excellence in powder metallurgy component design, receiving the 2025 Award of Distinction from the Metal Powder Industries Federation (MPIF). This award highlights the innovative design of reaction blocks and cam plates, which play a crucial role in mechanical locking rear differentials, showcasing the benefits of powder metal utilization.
Additionally, Amsted Automotive, formed through the merger of several companies, maintains a strong manufacturing presence across North America, Europe, and Asia. With a commitment to advanced metal-forming technologies, the company produces over 200 million components annually, reinforcing its status as a leader in innovative propulsion solutions for the automotive powertrain systems. As the industry evolves, both SK keyfoundry's semiconductor advancements and Amsted Automotive's recognition signify a broader trend towards enhanced efficiency and performance in automotive technology.
