Siemens AG Partners with Rapidus to Revolutionize Semiconductor Manufacturing Processes
- Siemens partners with Rapidus to revolutionize semiconductor design and manufacturing for the 2nm generation using advanced EDA technology.
- The collaboration aims to enhance yield and efficiency through a manufacturing-for-design approach and a comprehensive reference flow.
- Siemens introduces an enhanced EDA toolset with AI capabilities, positioning itself as a leader in semiconductor innovation.
Siemens Partners with Rapidus to Transform Semiconductor Manufacturing
Siemens Digital Industries Software announces a strategic collaboration with Rapidus Corporation aimed at revolutionizing semiconductor design and manufacturing processes for the 2nm generation. This partnership focuses on developing a process design kit that utilizes the Calibre® platform, recognized as the industry-standard solution for physical verification, manufacturing optimization, and reliability assessment. By integrating Siemens' electronic design automation (EDA) technology into Rapidus' manufacturing framework, the companies emphasize a manufacturing-for-design (MFD) approach that promises to enhance yield and efficiency from the early stages of production.
The collaboration aims to create a comprehensive reference flow that seamlessly connects design, verification, and manufacturing processes. This integration is crucial for Rapidus' Rapid and Unified Manufacturing Service (RUMS), which is designed to expedite the semiconductor production timeline while ensuring high reliability and scalability. Siemens EDA CEO Mike Ellow underscores that this partnership is a significant step towards fostering a new ecosystem that enhances design and manufacturing co-optimization. The initiative seeks to address industry challenges by ensuring secure design data management and minimizing risks of information leakage, which are critical in the competitive semiconductor landscape.
Dr. Atsuyoshi Koike, CEO of Rapidus, reinforces the commitment to advancing the co-optimization of manufacturing and design processes. The collaboration embodies Rapidus' Design Manufacturing Co-Optimization (DMCO) concept, which is expected to significantly shorten the time to tape-out for the 2nm gate-all-around process. This initiative not only reflects Rapidus' ambition to lead in semiconductor manufacturing but also aligns with the broader trend of integrating advanced technologies into manufacturing processes to meet customer demands more swiftly and effectively.
In a related development at the 2025 Design Automation Conference, Siemens introduced an enhanced EDA toolset that incorporates advanced AI capabilities, aimed at transforming semiconductor and printed circuit board (PCB) design workflows. This toolset allows engineers to securely leverage AI within existing frameworks, significantly enhancing productivity and innovation. With a strong focus on customization and seamless integration, Siemens positions itself at the forefront of EDA innovation, catering to the increasing demands of the semiconductor market.
As the semiconductor industry evolves, partnerships like that of Siemens and Rapidus highlight the importance of collaboration and technological integration in meeting the challenges of next-generation manufacturing. This move not only strengthens Siemens' portfolio but also showcases a commitment to pioneering advancements that can shape the future of semiconductor design and production.