Back/Eoptolink Launches 12.8T XPO Optical Transceiver for AI Data Center Connectivity Enhancements
tech·March 12, 2026·xpo

Eoptolink Launches 12.8T XPO Optical Transceiver for AI Data Center Connectivity Enhancements

ED
Editorial
Cashu Markets·2 min read
TL;DR
  • Eoptolink's 12.8T XPO optical transceiver offers 12.8 Tbps throughput with 64 lanes at 200 Gbps each.
  • The XPO transceiver features a cold plate design, supporting up to 400W cooling for high-density performance.
  • Eoptolink is a founding member of the XPO MSA, promoting high-density optical technology and industry collaboration.

Eoptolink's 12.8T XPO Optical Transceiver Revolutionizes AI Data Center Connectivity

Eoptolink Technology Inc., Ltd. unveils its innovative 12.8T XPO optical transceiver, marking a significant advancement for AI data center architectures, including scale-up and scale-out systems. This state-of-the-art transceiver offers a remarkable throughput capability of 12.8 terabits per second (Tbps) by utilizing an impressive 64 lanes, each operating at 200 Gbps. The XPO's design achieves a staggering front-panel density of 204.8 Tbps within a compact 4-RU rack, greatly surpassing the capabilities of current optical solutions, which are limited to 1.6T OSFP systems. Such enhancements in throughput and density are essential for managing the growing data requirements in modern AI-driven environments.

To address the demands of high-power environments, the XPO transceiver incorporates a sophisticated cold plate design that can accommodate cooling requirements of up to 400W per module. This feature is crucial for maintaining thermal efficiency while enabling significant port density. Sean Davies, Vice President of Sales at Eoptolink, highlights that the XPO is engineered to meet escalating network bandwidth demands. The transceiver’s flexible architecture further supports various interface configurations, including linear, half-retimed, and fully-retimed systems, providing seamless integration into existing infrastructures.

Moreover, Eoptolink has established its position as a founding member of the XPO Multi-Source Agreement (MSA), which is dedicated to developing a new classification of high-density, liquid-cooled pluggable optics. This collaborative approach reflects Eoptolink’s commitment to advancing optical technologies and promoting interoperability within the industry. Eoptolink plans to showcase the 12.8T XPO and its range of optical transceiver solutions at booth #1211 during the upcoming OFC 2026 in Los Angeles. With a continued emphasis on research and development, Eoptolink remains focused on delivering high-performance optical transceivers for applications in AI and machine learning clusters, as well as cloud data centers.

In addition to its product launch, Eoptolink's participation in the MSA signifies a strategic move towards enhancing collaboration among key players in the optical interconnect market. This initiative promotes the development and adoption of next-generation technologies, ultimately benefiting end users by increasing availability and reducing costs in high-performance data environments. As the demand for advanced optical solutions grows, Eoptolink’s innovations position the company as a leader in the global telecom and enterprise markets.

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