QuickLogic demos eFPGA chiplet integration on Intel 18A at Chiplet Summit

QuickLogic pushes eFPGA chiplet integration on Intel 18A at Chiplet Summit

SANTA CLARA, California — QuickLogic is showcasing how embedded FPGA (eFPGA) chiplets enable post-silicon adaptability and flexible heterogeneous integration as the company presents at Chiplet Summit 2026. The technical session, titled "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel 18A," is delivered by Trey Peterson, an applications engineer at QuickLogic, in Session E-202 on Thursday, Feb. 19 from 3:00 p.m. to 4:20 p.m. The presentation focuses on using eFPGA chiplets to extend platform flexibility in advanced process nodes and offers concrete examples for developers, system architects and equipment makers.

QuickLogic frames the Intel 18A deployment as a practical demonstration of marrying programmability with advanced packaging to address late-stage functional changes and performance trade-offs. The company explains that integrating an eFPGA chiplet provides designers with post-silicon reconfiguration, which can be used to tune AI endpoint acceleration, adapt to evolving IP requirements, or correct field issues without resorting to a full silicon respin. The session highlights power and performance considerations and aims to give OEMs and system architects guidance on integration pathways in heterogeneous multi-die assemblies.

The talk also situates eFPGA chiplets within broader industry moves toward chiplet architectures and heterogeneous integration. QuickLogic positions its embedded FPGA Hard IP, discrete FPGAs and eFPGA-based chiplets as enablers of scalable, ruggedized solutions for markets with demanding reliability and low-power constraints, such as aerospace, defense and industrial applications. By demonstrating deployment on a leading advanced node, the company seeks to illustrate a route for combining cutting-edge process technology with adaptable FPGA fabrics to meet diverse system-level requirements.

Booth demonstrations and engineer access

At Booth 416, QuickLogic exhibits its eFPGA IP, eFPGA-based chiplets, ruggedized FPGAs and chiplet integration options during the show. Attendees can visit during exhibit hours on Wednesday, Feb. 18 (12:30 p.m.–8:00 p.m.) and Thursday, Feb. 19 (12:00 p.m.–3:00 p.m.) to request demos, discuss integration choices and obtain technical collateral from company engineers.

Market focus and tooling commitments

The company reiterates its commitment to open-source toolchains and low-power design in the press release distributed via PR Newswire, underscoring product targets that include endpoint AI acceleration and mission-critical applications across aerospace, defense, industrial, computing and consumer markets. More technical information and product details are available from QuickLogic’s website.