Axcelis Technologies to Present Key Innovations at CS Asia 2026 Conference
- Axcelis Technologies will be the Diamond Sponsor of the Compound Semiconductor Asia Conference (CS Asia) 2026 in Shanghai.
- CEO Russell Low will deliver a keynote on innovations in ion implantation for enhancing compound semiconductor performance.
- Axcelis continues to develop solutions like the Purion Power Series+ to support cost-effective power semiconductor applications.
Axcelis Technologies to Lead Discussions on Ion Implantation at CS Asia 2026
Axcelis Technologies, Inc. (Nasdaq: ACLS), a key player in the semiconductor industry as a supplier of ion implantation solutions, announces its role as the Diamond Sponsor of the upcoming Compound Semiconductor Asia Conference (CS Asia) 2026. Set to take place from March 24-27, 2026, at the Kerry Hotel in Pudong, Shanghai, this conference runs concurrently with SEMICON China 2026. The event serves as a crucial platform for discussing advancements and developments in semiconductor technology across the Asia Pacific region, especially given the increasing global demand for innovative energy solutions.
In a spotlight moment for the company, President and CEO Russell Low, PhD, will present the opening Keynote Speech titled "Advancing Power and Compound Semiconductor Performance Through Ion Implantation Innovation." This address is anticipated to highlight critical advancements in ion implantation technology that could bolster the performance efficiencies in compound semiconductors, which are essential for a wide array of applications, particularly in clean energy. The focus aligns with Axcelis’ ongoing commitment to delivering high-productivity solutions essential for integrated circuit manufacturing.
In addition to Low's keynote, Hongchen Zhao, PhD, Axcelis' Worldwide Applications Director, will also contribute by presenting innovative implant solutions aimed at lowering costs in silicon carbide (SiC) super junctions. This presentation underscores the company's dedication to reducing operational expenses while enhancing performance in power semiconductor applications. With the introduction of its next-generation Purion Power Series+ Platform, Axcelis aims to solidify its status as a market leader in ion implantation technologies, further meeting the needs of chipmakers in China and beyond.
Axcelis invites stakeholders and industry professionals to explore its advancements and expertise by visiting the company’s website. As Axcelis prepares for CS Asia 2026, the company not only positions itself as a thought leader but also underscores its role in empowering the semiconductor industry’s transition toward cleaner and more efficient energy solutions.