Axcelis Technologies
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$5.58B
55.4
6.17
$1.02B
Axcelis Technologies, Inc. engages in the manufacture of capital equipment for the semiconductor chip manufacturing industry. The company is headquartered in Beverly, Massachusetts and currently employs 1,465 full-time employees. The company went IPO on 2000-07-11. The firm is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the critical and enabling steps in the IC manufacturing process. Its ion implantation products include high current ion implant, high energy ion implant and medium current ion implant. The firm's Purion H, Purion Dragon, Purion H200, and GSD/E2 Ovation spot beam, high current systems cover all traditional high current requirements as well as those associated with emerging and future devices. Its Purion XE, EXE, and other Purion high energy systems combine its production-proven RF Linac high energy, spot beam technology with the Purion platform wafer handling system. Its medium current ion implant products include its Purion M Si and SiC medium current systems. The company also offers its customers aftermarket service and support.
Axcelis Technologies experienced significant stock growth due to increased interest in chip manufacturing, reflecting a robust demand for advanced semiconductor equipment in the industry.
Axcelis Technologies, Inc. engages in the manufacture of capital equipment for the semiconductor chip manufacturing industry. The company is headquartered in Beverly, Massachusetts and currently employs 1,465 full-time employees. The company went IPO on 2000-07-11. The firm is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the critical and enabling steps in the IC manufacturing process. Its ion implantation products include high current ion implant, high energy ion implant and medium current ion implant. The firm's Purion H, Purion Dragon, Purion H200, and GSD/E2 Ovation spot beam, high current systems cover all traditional high current requirements as well as those associated with emerging and future devices. Its Purion XE, EXE, and other Purion high energy systems combine its production-proven RF Linac high energy, spot beam technology with the Purion platform wafer handling system. Its medium current ion implant products include its Purion M Si and SiC medium current systems. The company also offers its customers aftermarket service and support.
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