Exponent Showcases FANUC's Innovative Automation Solutions for Food Processing at PACK EXPO

Innovative Automation Solutions for Food Processing at PACK EXPO

FANUC America is poised to make a significant impact at the upcoming PACK EXPO Las Vegas, occurring from September 29 to October 1, 2025. The company will showcase its advanced food-grade robotic solutions, highlighting the DR-3iB/6 stainless IP69K-rated delta robot and the food-grade SR-12iA/C SCARA robot. These robots are engineered to meet USDA and FDA sanitation standards, making them ideal for high-pressure washdown environments prevalent in food processing. Demonstrating their capabilities through the packaging of sausage links, FANUC aims to emphasize the blend of sanitation, safety, and performance in food automation.

FANUC’s commitment to hygiene is evident in its design and operational features. The robots utilize vacuum grippers and FANUC's iRPickTool for precise handling, ensuring that food items are managed with utmost care. The robots are equipped with NSF-H1 certified food-grade grease and boast IP69K protection, which safeguards against both water and dust infiltration. This robust engineering ensures that the robots not only perform efficiently but also adhere to stringent sanitation protocols, which have become increasingly critical in the food industry.

In addition to its delta and SCARA robots, FANUC presents collaborative robots (cobots) capable of handling a variety of food items, including baked goods like chocolate chip cookies and brownies. The dual CRX-20iA/L cobots are designed to enhance production efficiency by performing multiple tasks, such as loading cookies onto conveyor belts and packaging them with precision using FANUC's iRVision technology. This innovative approach not only addresses the ongoing labor shortages in the food processing sector but also improves sanitation and overall production throughput while maintaining consistent quality.

Sustainable Innovations in Flexible Packaging

Morchem, a global leader in laminating adhesives, is also set to participate in PACK EXPO, celebrating its fortieth anniversary this September. The company focuses on introducing new solventless adhesives that align with the industry's trend toward sustainability and cost-effectiveness. Morchem's advancements in solvent-free adhesive technology significantly reduce environmental impact by minimizing emissions, energy consumption, and freight costs.

As the flexible packaging sector evolves, Morchem emphasizes the shift from rigid to flexible packaging solutions. This transition not only enhances recyclability but also supports lightweighting initiatives, ultimately lowering material usage and costs. Visitors can explore Morchem's innovative offerings at booth SL-18034 in the South Lower Hall, showcasing their commitment to being a vital partner in innovation within the packaging industry.