Wolfspeed (New)

Filed a patent for "power semiconductor devices having gate trenches with asymmetrically rounded upper and lower trench corners and/or recessed gate electrodes and methods of fabricating such devices" on Thu, February 27, 2025

Filed a patent for "wide bandgap trench gate semiconductor device with buried gate" on Thu, February 20, 2025

Filed a patent for "submounts with stud protrusions for semiconductor packages" on Thu, January 30, 2025

Filed a patent for "biasing circuit for radio frequency amplifier" on Thu, January 30, 2025

Filed a patent for "power package configured with additional functionality" on Thu, January 9, 2025

Filed a patent for "compact semiconductor die with group iii nitride-based amplifier" on Fri, July 7, 2023

Filed a patent for "integrated resistors with increased sheet resistance for rf applications and methods of fabricating the same" on Thu, December 26, 2024

Filed a patent for "thermally conductive interposer, a device implementing a thermally conductive interposer, and processes for implementing the same" on Thu, December 26, 2024

Filed a patent for "topside cooling for semiconductor device" on Thu, December 26, 2024

Filed a patent for "implantation for isolated channel structures in group iii-nitride semiconductor devices" on Thu, December 26, 2024

Filed a patent for "low reverse leakage current power schottky diodes having reduced current crowding at the lower blocking junction corners" on Thu, December 26, 2024

Filed a patent for "group iii nitride doherty amplifier using different epitaxial structures" on Thu, December 26, 2024

Filed a patent for "silicon carbide semiconductor devices with superjunctions" on Thu, December 26, 2024

Filed a patent for "doherty amplifier with improved video bandwidth" on Thu, December 26, 2024

Filed a patent for "field peak reduction in semiconductor devices with metal corner rounding" on Thu, December 12, 2024

Filed a patent for "improved thermal and electrical conductivity between metal contacts" on Thu, December 12, 2024

Filed a patent for "low contact resistance in semiconductor devices with implanted regions" on Thu, December 19, 2024

Filed a patent for "packaged device having an integrated passive device with wafer level formed connection to at least one semiconductor device and processes for implementing the same" on Thu, December 19, 2024

Filed a patent for "die-attach fillet height reduction" on Thu, December 19, 2024

Filed a patent for "semiconductor package" on Thu, December 19, 2024

Filed a patent for "silicon carbide device with single metallization process for ohmic and schottky contacts" on Thu, December 19, 2024

Filed a patent for "power semiconductor devices including beryllium metallization" on Thu, October 24, 2024

Filed a patent for "heteroepitaxial semiconductor devices with enhanced thermal dissipation" on Thu, October 24, 2024

Filed a patent for "signal loop busbars and semiconductor power modules including the same and processes of implementing the same" on Thu, October 24, 2024

Filed a patent for "semiconductor devices with low barrier height schottky contacts" on Thu, October 24, 2024