ASE Technology Holding Co.
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$30.63
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$30.63
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$30.66
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$26.68B
17.9
1.17
$18.52B
ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2018-04-30. The investment business includes general investment business projects. The packaging and testing business provides integrated circuit (IC) services, including packaging and module design, IC packaging, multi-chip packaging, micro and hybrid modules, memory packaging, front-end testing, wafer probe testing, finished product testing, substrate design, and manufacturing. The electronic manufacturing service business mainly provides a series of professional services such as development and design, material procurement, production and manufacturing, logistics, maintenance and other after-sales services for domestic and foreign brand manufacturers in the fields of communications, consumer electronics, computers, storage industrial, automotive electronics and other types of electronic products.
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ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2018-04-30. The investment business includes general investment business projects. The packaging and testing business provides integrated circuit (IC) services, including packaging and module design, IC packaging, multi-chip packaging, micro and hybrid modules, memory packaging, front-end testing, wafer probe testing, finished product testing, substrate design, and manufacturing. The electronic manufacturing service business mainly provides a series of professional services such as development and design, material procurement, production and manufacturing, logistics, maintenance and other after-sales services for domestic and foreign brand manufacturers in the fields of communications, consumer electronics, computers, storage industrial, automotive electronics and other types of electronic products.
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