Himax Technologies
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Himax Technologies, Inc. is a semiconductor solution provider dedicated to display imaging processing technologies. The company is headquartered in Tainan, Tainan and currently employs 2,238 full-time employees. The company went IPO on 2006-03-31. The firm offers comprehensive automotive integrated circuit (IC) solutions, including traditional driver ICs, in-cell touch and display driver integration, large touch and display driver integration and local dimming timing controllers. The firm's principal product lines include display drivers and timing controllers, touch controller ICs, thin film transistor liquid crystal display (TFT-LCD) television and monitor semiconductor solutions, intellectual property (IP) and application specific integrated circuit (ASIC) service, liquid crystal on silicon (LCOS) and micro-electro mechanical systems (MEMS) products, power ICs, complementary metal-oxide-semiconductor (CMOS) image sensor product, and wafer level optics products.
Himax Technologies' T2000 Color ePaper controller successfully integrates with E Ink's new 75-inch display, enhancing e-paper technology and expanding its applications in large screens.
Himax Technologies, Inc. is a semiconductor solution provider dedicated to display imaging processing technologies. The company is headquartered in Tainan, Tainan and currently employs 2,238 full-time employees. The company went IPO on 2006-03-31. The firm offers comprehensive automotive integrated circuit (IC) solutions, including traditional driver ICs, in-cell touch and display driver integration, large touch and display driver integration and local dimming timing controllers. The firm's principal product lines include display drivers and timing controllers, touch controller ICs, thin film transistor liquid crystal display (TFT-LCD) television and monitor semiconductor solutions, intellectual property (IP) and application specific integrated circuit (ASIC) service, liquid crystal on silicon (LCOS) and micro-electro mechanical systems (MEMS) products, power ICs, complementary metal-oxide-semiconductor (CMOS) image sensor product, and wafer level optics products.
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